JPH0457469B2 - - Google Patents
Info
- Publication number
- JPH0457469B2 JPH0457469B2 JP60081958A JP8195885A JPH0457469B2 JP H0457469 B2 JPH0457469 B2 JP H0457469B2 JP 60081958 A JP60081958 A JP 60081958A JP 8195885 A JP8195885 A JP 8195885A JP H0457469 B2 JPH0457469 B2 JP H0457469B2
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- workpiece
- suction
- suction head
- turntable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000007246 mechanism Effects 0.000 claims description 35
- 239000000969 carrier Substances 0.000 claims description 12
- 238000005498 polishing Methods 0.000 claims description 10
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000011109 contamination Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60081958A JPS61241060A (ja) | 1985-04-17 | 1985-04-17 | 平面自動研磨装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60081958A JPS61241060A (ja) | 1985-04-17 | 1985-04-17 | 平面自動研磨装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61241060A JPS61241060A (ja) | 1986-10-27 |
| JPH0457469B2 true JPH0457469B2 (en]) | 1992-09-11 |
Family
ID=13761006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60081958A Granted JPS61241060A (ja) | 1985-04-17 | 1985-04-17 | 平面自動研磨装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61241060A (en]) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0755448B2 (ja) * | 1990-03-14 | 1995-06-14 | 九州電子金属株式会社 | 両面精密研摩用ラップ盤 |
| US5174067A (en) * | 1990-10-19 | 1992-12-29 | Shin-Etsu Handotai Co., Ltd. | Automatic wafer lapping apparatus |
| US5329732A (en) * | 1992-06-15 | 1994-07-19 | Speedfam Corporation | Wafer polishing method and apparatus |
| US5498199A (en) * | 1992-06-15 | 1996-03-12 | Speedfam Corporation | Wafer polishing method and apparatus |
| JPH11207611A (ja) * | 1998-01-21 | 1999-08-03 | Shin Etsu Handotai Co Ltd | 両面研磨装置におけるワークの自動搬送装置 |
| JP4620898B2 (ja) * | 2001-04-23 | 2011-01-26 | 不二越機械工業株式会社 | 研磨装置システム |
| JP5265281B2 (ja) * | 2008-09-12 | 2013-08-14 | 不二越機械工業株式会社 | 両面研磨装置 |
| JP5524676B2 (ja) * | 2010-03-31 | 2014-06-18 | コマツＮｔｃ株式会社 | 加工システムにおけるワーク搬入出装置及びその方法 |
| JP5512354B2 (ja) * | 2010-03-31 | 2014-06-04 | コマツＮｔｃ株式会社 | 棒状ワークの加工方法及びその装置 |
| JP6183301B2 (ja) * | 2014-06-16 | 2017-08-23 | 信越半導体株式会社 | 自動ハンドリング装置 |
-
1985
- 1985-04-17 JP JP60081958A patent/JPS61241060A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61241060A (ja) | 1986-10-27 |
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